functionality
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dominance
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| Highly flexible four-quadrant voltage and current source/load, combined with high-accuracy voltmeter and ammeter |
With 6½-bit resolution, it offers a performance advantage over competing products. |
| Source or trap (2651A) pulse power up to 2000W (±40V, ±50A) or DC power up to 200W (±10V@±20A, ±20V@±10A, ±40V@±5A); easily connect two devices (in series or parallel) to create solutions up to ±100A or ±80V |
Supports calibration/testing of power semiconductors, HBLEDs, optical devices, solar cells, GaN, SiC and other composite materials and devices. Applications include semiconductor junction temperature calibration; high-speed, high-precision digitization; electromigration studies; and high-current, high-power device testing. |
| Source or Trap (2657A) DC or Pulsed Power up to 180W (±3000V@20mA, ±1500V@120mA) |
Provides the high voltages required for the qualification and testing of power semiconductor devices, including GaN, SiC and other composite materials and devices, breakdown and leakage testing up to 3kV, and sub-millisecond transient qualification. |
| Built-in web browser-based software |
Supports remote control from any browser, any computer, from anywhere in the world. |
| Digital or integral measurement modes available |
Supports accurate characterization of transient and steady state behavior, including rapidly changing thermal effects. |
| TSP (Test Script Processing) technology |
Easy system integration with 2657A models and 2600B series models. |
| TSP-Link Channel Expansion Bus |
Allows multiple 2651A and 2657A to be combined with select 2600B Series SMU instruments to form an integrated system of up to 32 channels. |
| Compatible with Model 8010 High Power Device Test Fixture and Model 8020 High Power Interface Panel |
Provides a secure and convenient connection for testing high power devices at the package or wafer level. |
| Optional ACS Basic Semiconductor Component Calibration Software |
Enhances efficiency when performing package calibration during product development, quality inspection, or failure analysis. |